Microelectronics and Packaging Conference
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Microelectronics and Packaging Conference

The 22nd European Microelectronics and Packaging Conference (EMPC) is the established international forum for engineers working in the field and others wanting to learn from this leading event.

EMPC-2019 in Pisa offers the best of microelectronics packaging and interconnection technologies, providing top quality coverage of technological innovation in this field

Please join us at Microelectronics and Packaging Conference EMPC & Exhibition in Italy.

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