Conference paper: What kind of component packages are ideal for IMSE
TactoTek presented at NordPack Conference in Oulu, 14 June 2018
The innovative IMSE technology is significantly different from the conventional electronics in which components are reflow soldered onto printed circuit boards. Many of the packages optimized for conventional electronics can be used with IMSE technology. However, they are not ideal. In this paper we present the ideal component package for IMSE integration and explain the reasons for the requirements. We also present the TactoTek internal component qualification process. It verifies that component packages do not lower IMSE manufacturing yield and are reliable in IMSE designs.
Read the whole conference paper here: Component Packages For IMSE