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TactoTek Presents Innovative Injection-Molded Structural Electronics at IDTechEx Berlin
TactoTek Presentations Include Opportunities and Challenges of Injection-Molded Structural Electronics; Structural Electronics Master Class
OULU, FINLAND – TactoTek, a leading manufacturer of injection-molded 3D structural electronics solutions today announced that it will present the latest developments in its innovative structural electronics designs at the IDTechEx conference in Berlin, Germany on April 28-29 and during a featured IDTechEx Master Class on April 30th. TactoTek is currently involved in the development of solutions for a wide range of market segments, such as Internet of Things; automotive solutions, including electric vehicles; and wearable technology, which are featured topics of discussion during the conference.
David Rice, senior vice president of marketing for TactoTek, will present on Injection-Molded Structural Electronics, May 29 at 9:20am at IDTechEx. Miikka Kärnä, head of TactoTek’s customer-facing Product Creation team, will discuss designing for Structural Electronics during the Structural Electronics Master Class, May 30 at 2:30pm.
TactoTek’s solution integrates printed circuitry, printed touch controls, and discrete electronic components, such as LEDs and ICs, into 3D injection-molded plastics that can be mass-produced using standard equipment. By incorporating circuitry and electronics directly into plastic structures, TactoTek enables brands to design light, thin, and durable components that often eliminate structural elements, reduce the size of PCBs, and simplify product assembly. These capabilities are combined to create innovative form factors with sophisticated features in a wide variety of designs, such as control panels and unique illumination solutions.
To facilitate customer transition to structural electronics designs, TactoTek’s Product Creation team partners with customers to adapt their designs to structural electronics that evolve into prototypes optimized for mass production.
“Wearable technology, the Internet of Things and other new applications of electronics cannot be adequately served by the 100-year-old components-in-a-box approach,” said Dr. Peter Harrop, Chairman of IDTechEx and author of the new report, ‘Structural Electronics 2015-2025.’ “Lightweight, shaped, rugged, structural construction, where TactoTek excels, is essential. It will be invaluable in electric vehicles, for example.”
Benefits of the TactoTek approach include design freedom, durability, and space-efficient, lightweight designs. Whether they include sensors, controls, antennae, circuitry, integrated circuits, or lighting features, TactoTek enables designs that stand out in the marketplace.
“Whether the market is IoT, wearables, or vehicles, the next generation of electronics must support the everincreasing demand for incorporating intelligence into designs while supporting rapid product cycles: TactoTek was established to meet this need. We have developed our capabilities in cooperation with industry leaders in several key markets to support this paradigm shift,” said Jussi Harvela, CEO of TactoTek.
TactoTek prototypes and manufactures products in its Oulu, Finland, factory that includes a complete range of production capabilities; mass production can be performed by TactoTek or licensed to TactoTek-certified facilities