Let's turn conventional structures into smart, natural, and interactive surfaces.
We offer a smarter, more efficient, and sustainable way to develop unique user experiences. With IMSE, you can integrate aesthetics, mechanics, and electronics in a single-piece, ultra-thin surface structure.
Conductive patterns and, optionally, a printed decoration layer are added to a substrate (for instance, a plastic film) using methods such as screen printing.
Electronic components are mounted on the flat substrate using standard high-speed pick-and-place (SMT) equipment. Components are attached to the substrate using conductive and structural adhesives.
The substrate with electronics is formed into its desired 3D shape.
The formed electronics and cosmetic substrates are overmolded with, for instance, injection molding. The output is a solid, thin, single-piece IMSE structure with encapsulated electronics.